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Technology
ESB strives to keep abreast with current manufacturing technologies to keep up with the customer requirements. We also have lead-free manufacturing capabilities. Working very closely with our partner-vendors, we deliver quality products that may call for such technologies as:

Printed Circuit Board Assembly
• Surface Mount
• Through Hole
• Mixed Technology (SMT and Through Hole)
• Ball-Grid Array (BGA), with X-Ray Machine & Rework Station
• Flexible PCBA
• Chip-on-Board (COB)
• Chip-on-Flex Circuit
 
Soldering
• No Clean
• Water Soluble
• Lead-Free
 
Board Cleaning
• Aqueous
• Semi-Aqueous
ESB... combining US-based customer service and Asian assembly and procurement for cost-competitive electronics manufacturing while maintaining high levels of service and quality.
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